System-on-Package (SoP) Technologies to Integrate mm-Wave
Assistant Professor Young Chul Lee
Division of Marine Electronics and Communication
Mokpo National Maritime University (MMU)
In this lecture, system-on-package (SoP) technologies
based on LTCC (low-temp. co-fired ceramic) will be
presented for mm-wave radio system applications. The key
issues to implement compact SoP modules are the
attenuation at the transmission lines and transitions
for interconnection between components, crosstalk
between them, compact passive devices such as LPF, BPF
and antenna, and their integration in SoP modules.
Several research approaches have been tried to solve
these issues will be presented. Especially, transmission
lines and transitions using air cavities integrated in
the LTCC substrate are discussed for loss reduction.
Resonant behaviors due to 3-D structures are analyzed
and structures proposed for their suppression are
explained using LTCC modules. Research results of
compact 3-D passive devices such as a LPF, BPF,
diplexer, and antenna are also in detail presented.
Finally, compact-sized 60GHz transmitter, receiver and
transceiver LTCC SoP modules integrating LTCC passive
components and their link-test results are presented.
Brief Biography of the Speaker:
Young Chul Lee received his B.S. and M.S degrees in
electronic engineering from Yeungnam University,
Gyeongsan, Korea, in 1995 and 1997, respectively, and
Ph.D. degree in electronic engineering from Information
and Communications University (ICU), Daejeon, Korea, in
2005. From 1997 to 2000, he was with the R&D Division,
LG Semicon Inc., Cheongju, Korea, where he was involved
in the development of MOSFET devices for DRAM
applications. In 2005, he joined Mokpo National Maritime
University (MMU), Mokpo, Korea, as an assistant
professor in Division of Marine Electronics and
Communication Engineering. His professional interests
are millimeter-wave circuits and systems, 3D integration
of RF circuits using LTCC based System-in-Package (SiP)
technology, and reconfigurable RF circuits based on
tunable dielectric thin films.