Plenary Lecture

Plenary Lecture

System-on-Package (SoP) Technologies to Integrate mm-Wave Radio Systems

Assistant Professor Young Chul Lee
Division of Marine Electronics and Communication Engineering
Mokpo National Maritime University (MMU)
Jeonnam, Korea

Abstract: In this lecture, system-on-package (SoP) technologies based on LTCC (low-temp. co-fired ceramic) will be presented for mm-wave radio system applications. The key issues to implement compact SoP modules are the attenuation at the transmission lines and transitions for interconnection between components, crosstalk between them, compact passive devices such as LPF, BPF and antenna, and their integration in SoP modules. Several research approaches have been tried to solve these issues will be presented. Especially, transmission lines and transitions using air cavities integrated in the LTCC substrate are discussed for loss reduction. Resonant behaviors due to 3-D structures are analyzed and structures proposed for their suppression are explained using LTCC modules. Research results of compact 3-D passive devices such as a LPF, BPF, diplexer, and antenna are also in detail presented. Finally, compact-sized 60GHz transmitter, receiver and transceiver LTCC SoP modules integrating LTCC passive components and their link-test results are presented.

Brief Biography of the Speaker:
Young Chul Lee received his B.S. and M.S degrees in electronic engineering from Yeungnam University, Gyeongsan, Korea, in 1995 and 1997, respectively, and Ph.D. degree in electronic engineering from Information and Communications University (ICU), Daejeon, Korea, in 2005. From 1997 to 2000, he was with the R&D Division, LG Semicon Inc., Cheongju, Korea, where he was involved in the development of MOSFET devices for DRAM applications. In 2005, he joined Mokpo National Maritime University (MMU), Mokpo, Korea, as an assistant professor in Division of Marine Electronics and Communication Engineering. His professional interests are millimeter-wave circuits and systems, 3D integration of RF circuits using LTCC based System-in-Package (SiP) technology, and reconfigurable RF circuits based on tunable dielectric thin films.

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